Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...
Enregistré dans:
| Hovedforfatter: | |
|---|---|
| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
New York, NY :
Springer New York : Imprint: Springer
[20..].
Cham : Springer Nature |
| Udgivelse: | 2012. |
| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Power Electronic Packaging, Texte imprimé, 9781461410522 |
Indholdsfortegnelse:
- Challenges of Power Electronic Packaging Power Package Electrical Isolation Design Discrete Power MOSFET Package Design and Analysis Power IC Packaging Design and Analysis Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations Thermal Management, Design and Cooling for Power Electronics Material Characterization for Power Electronics Packaging Power Package Typical Assembly Process Power Packaging Typical Reliability and Tests Power Packaging Modeling and Challenges Power Package Thermal and Mechanical Co-Design Simulation Automation Power Package Electrical and Multiple Physics Simulation.