Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...
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| Hlavní autor: | |
|---|---|
| Médium: | Livre numérique |
| Jazyk: | Anglais |
| Vydáno: |
New York, NY :
Springer New York : Imprint: Springer
[20..].
Cham : Springer Nature |
| Vydání: | 2012. |
| On-line přístup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Poznámka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Power Electronic Packaging, Texte imprimé, 9781461410522 |
| LEADER | 04304nam a22003257a 4500 | ||
|---|---|---|---|
| 001 | 974007 | ||
| 008 | 120309q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN159081858 | ||
| 020 | |a 9781461410539 | ||
| 020 | |a 9781461410539 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.317 | ||
| 100 | 1 | |a Liu, Yong, |d 1966- | |
| 245 | 1 | 0 | |a Power Electronic Packaging : |b Design, Assembly Process, Reliability and Modeling |c by Yong Liu. |
| 250 | |a 2012. | ||
| 260 | |a New York, NY : |b Springer New York : |b Imprint: Springer. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Challenges of Power Electronic Packaging Power Package Electrical Isolation Design Discrete Power MOSFET Package Design and Analysis Power IC Packaging Design and Analysis Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations Thermal Management, Design and Cooling for Power Electronics Material Characterization for Power Electronics Packaging Power Package Typical Assembly Process Power Packaging Typical Reliability and Tests Power Packaging Modeling and Challenges Power Package Thermal and Mechanical Co-Design Simulation Automation Power Package Electrical and Multiple Physics Simulation. | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also: Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designs Power Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices | ||
| 776 | 0 | |t Power Electronic Packaging |b Texte imprimé |z 9781461410522 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4614-1053-9 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-8QXTJ8PT-7 |z Accès sur la plateforme Istex | |
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| 997 | |0 974007 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||