Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...
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| Glavni autori: | , , |
|---|---|
| Format: | Livre numérique |
| Jezik: | Anglais |
| Izdano: |
Berlin, Heidelberg :
Springer Berlin Heidelberg
[20..].
Cham : Springer Nature |
| Izdanje: | 1st ed. 2005. |
| Serija: | Microtechnology and MEMS
|
| Online pristup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Bilješka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Force Sensors for Microelectronic Packaging Applications, Texte imprimé, 9783540221876 |
| LEADER | 02920nam a22003497a 4500 | ||
|---|---|---|---|
| 001 | 948136 | ||
| 008 | 080409q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN123085632 | ||
| 020 | |a 9783540269458 | ||
| 041 | 0 | |a eng | |
| 082 | |a 620.115 | ||
| 100 | 1 | |a Schwizer, Jürg, |d 1973- | |
| 245 | 1 | 0 | |a Force Sensors for Microelectronic Packaging Applications |c by Jürg Schwizer, Michael Mayer, Oliver Brand. |
| 250 | |a 1st ed. 2005. | ||
| 260 | |a Berlin, Heidelberg : |b Springer Berlin Heidelberg. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Microtechnology and MEMS |x 2365-0680 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Sensor Design Measurement System Characterization Applications Conclusions and Outlook | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging | ||
| 700 | 1 | |a Brand, Oliver, |d 1964- |4 aut | |
| 700 | 1 | |a Mayer, Michael. |4 aut | |
| 776 | 0 | |t Force Sensors for Microelectronic Packaging Applications |b Texte imprimé |z 9783540221876 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/b138345 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-CSHMXCT3-H |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:748045058 |u https://ezproxy.univ-orleans.fr/login?url=https://dx.doi.org/10.1007/b138345 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:751496154 |u https://ezproxy.insa-cvl.fr/login?qurl=https://dx.doi.org/10.1007/b138345 |z Accès INSA CVL | |
| 997 | |0 948136 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||