Force Sensors for Microelectronic Packaging Applications

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...

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Hlavní autoři: Schwizer, Jürg, 1973-, Brand, Oliver, 1964- (Autor), Mayer, Michael (Autor)
Médium: Livre numérique
Jazyk:Anglais
Vydáno: Berlin, Heidelberg : Springer Berlin Heidelberg [20..].
Cham : Springer Nature
Vydání:1st ed. 2005.
Edice:Microtechnology and MEMS
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Poznámka: Archives Springer e-books (Licence nationale)
Archives Springer e-books (Licence nationale)
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Edition sous un autre format:• Force Sensors for Microelectronic Packaging Applications, Texte imprimé, 9783540221876
Popis
Shrnutí:This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging
Popis jednotky:Archives Springer e-books (Licence nationale)
Archives Springer e-books (Licence nationale)
ISBN:9783540269458
ISSN:2365-0680
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