RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Kaydedildi:
| Diğer Yazarlar: | , , |
|---|---|
| Materyal Türü: | Livre numérique |
| Dil: | Anglais |
| Baskı/Yayın Bilgisi: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| Edisyon: | 1st ed. 2010. |
| Online Erişim: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Not: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • RF and microwave microelectronics packaging, [edited by] Ken Kuang, Franklin Kim, Sean S. Cahill, New York, Springer, 2010, 1 vol. (XVI-285 p.), 978-1-441-90983-1 |