Solder Joint Technology : Materials, Properties, and Reliability
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...
שמור ב:
| מחבר ראשי: | |
|---|---|
| פורמט: | Livre numérique |
| שפה: | Anglais |
| יצא לאור: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| מהדורה: | 1st ed. 2007. |
| סדרה: | Springer Series in Materials Science
92 |
| גישה מקוונת: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| הערה: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 • Solder Joint Technology, Texte imprimé, 9780387515830 • Solder Joint Technology, Texte imprimé, 9781441922847 • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 |
תוכן הענינים:
- Copper Tin Reactions Copper Tin Reactions in Bulk Samples Copper Tin Reactions in Thin-Film Samples Copper Tin Reactions in Flip Chip Solder Joints Kinetic Analysis of Flux-Driven Ripening of Copper Tin Scallops Spontaneous Tin Whisker Growth: Mechanism and Prevention Solder Reactions on Nickel, Palladium, and Gold Electromigration and Thermomigration Fundamentals of Electromigration Electromigration in Flip Chip Solder Joints Polarity Effect of Electromigration on Solder Reactions Ductile to-Brittle Transition of Solder Joints Affected by Copper Tin Reaction and Electromigration Thermomigration