Lead Free Solder : Mechanics and Reliability
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...
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| Autore principale: | |
|---|---|
| Natura: | Livre numérique |
| Lingua: | Anglais |
| Pubblicazione: |
New York, NY :
Springer New York
2012.
Cham : Springer Nature |
| Accesso online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Lead free solder, mechanics and reliability, John Hock Lye Pang, New York, NY, Springer, 2012, x, 175 p., 978-1-461-40462-0 • Lead Free Solder, Texte imprimé, 9781461404644 • Lead Free Solder, Texte imprimé, 9781489991164 |