Solder Joint Technology : Materials, Properties, and Reliability
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...
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| Главный автор: | |
|---|---|
| Формат: | Livre numérique |
| Язык: | Anglais |
| Опубликовано: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Редактирование: | 1st ed. 2007. |
| Серии: | Springer Series in Materials Science
92 |
| Online-ссылка: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Примечание: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 • Solder Joint Technology, Texte imprimé, 9780387515830 • Solder Joint Technology, Texte imprimé, 9781441922847 • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 |