Solder Joint Technology : Materials, Properties, and Reliability
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...
Guardado en:
| Autor principal: | |
|---|---|
| Formato: | Livre numérique |
| Lenguaje: | Anglais |
| Publicado: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Edición: | 1st ed. 2007. |
| Colección: | Springer Series in Materials Science
92 |
| Acceso en línea: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 • Solder Joint Technology, Texte imprimé, 9780387515830 • Solder Joint Technology, Texte imprimé, 9781441922847 • Solder joint technology, materials, properties, and reliability, King-Ning Tu, New York, Springer, 2007, 1 vol. (XVI- 368 p.), Springer series in materials science, 978-0-387-38890-8 |
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| 100 | 1 | |a Tu, King-Ning. | |
| 245 | 1 | 0 | |a Solder Joint Technology : |b Materials, Properties, and Reliability |c edited by King-Ning Tu. |
| 250 | |a 1st ed. 2007. | ||
| 260 | |a New York, NY : |b Springer New York. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Springer Series in Materials Science |v 92 |x 2196-2812 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Copper Tin Reactions Copper Tin Reactions in Bulk Samples Copper Tin Reactions in Thin-Film Samples Copper Tin Reactions in Flip Chip Solder Joints Kinetic Analysis of Flux-Driven Ripening of Copper Tin Scallops Spontaneous Tin Whisker Growth: Mechanism and Prevention Solder Reactions on Nickel, Palladium, and Gold Electromigration and Thermomigration Fundamentals of Electromigration Electromigration in Flip Chip Solder Joints Polarity Effect of Electromigration on Solder Reactions Ductile to-Brittle Transition of Solder Joints Affected by Copper Tin Reaction and Electromigration Thermomigration | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed | ||
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| 776 | 0 | |t Solder Joint Technology |b Texte imprimé |z 9780387515830 | |
| 776 | 0 | |t Solder Joint Technology |b Texte imprimé |z 9781441922847 | |
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