Designing TSVs for 3D integrated circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...
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| Main Authors: | , |
|---|---|
| Format: | Livre numérique |
| Language: | Anglais |
| Published: |
New York, NY :
Springer New York
2013.
Cham : Springer Nature |
| Series: | SpringerBriefs in Electrical and Computer Engineering
|
| Online Access: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455073 • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455097 |
| LEADER | 03336nam a22003497a 4500 | ||
|---|---|---|---|
| 001 | 949767 | ||
| 008 | 130325s2013 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN168303221 | ||
| 020 | |a 9781461455080 | ||
| 020 | |a 9781461455080 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.3815 | ||
| 100 | 1 | |a Khan, Nauman, |d 19..- | |
| 245 | 1 | 0 | |a Designing TSVs for 3D integrated circuits |c by Nauman Khan, Soha Hassoun. |
| 260 | |a New York, NY : |b Springer New York. | ||
| 260 | |a Cham : |b Springer Nature, |c 2013. | ||
| 490 | 0 | |a SpringerBriefs in Electrical and Computer Engineering |x 2191-8120 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 0 | |a Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions. | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. chttps://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper. | ||
| 700 | 1 | |a Hassoun, Soha. |4 aut | |
| 776 | 0 | |t Designing TSVs for 3D Integrated Circuits |b Texte imprimé |z 9781461455073 | |
| 776 | 0 | |t Designing TSVs for 3D Integrated Circuits |b Texte imprimé |z 9781461455097 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4614-5508-0 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-7SKBH9CD-N |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:748099468 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/978-1-4614-5508-0 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:751553964 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/978-1-4614-5508-0 |z Accès INSA CVL | |
| 997 | |0 949767 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||