Designing TSVs for 3D integrated circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...
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| Autori principali: | , |
|---|---|
| Natura: | Livre numérique |
| Lingua: | Anglais |
| Pubblicazione: |
New York, NY :
Springer New York
2013.
Cham : Springer Nature |
| Serie: | SpringerBriefs in Electrical and Computer Engineering
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| Accesso online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455073 • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455097 |