Designing TSVs for 3D integrated circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...
সংরক্ষণ করুন:
| প্রধান লেখক: | , |
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| বিন্যাস: | Livre numérique |
| ভাষা: | Anglais |
| প্রকাশিত: |
New York, NY :
Springer New York
2013.
Cham : Springer Nature |
| মালা: | SpringerBriefs in Electrical and Computer Engineering
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| অনলাইন ব্যবহার করুন: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| টীকা: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455073 • Designing TSVs for 3D Integrated Circuits, Texte imprimé, 9781461455097 |
| সংক্ষিপ্ত: | This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper. |
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| উপাদানের বিবরণ: | Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| আইসবিএন: | 9781461455080 |
| আইএসএসএন: | 2191-8120 |
| প্রবেশাধিকার: | Accès en ligne pour les établissements français bénéficiaires des licences nationales Accès soumis à abonnement pour tout autre établissement Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. chttps://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 |