Design for High Performance, Low Power, and Reliable 3D Integrated Circuits :: SCD d'Orléans

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous manufacturing-ready GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of ti...

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Podrobná bibliografie
Hlavní autor:	Lim, Sung Kyu
Médium:	Livre numérique
Jazyk:	Anglais
Vydáno:	New York, NY : Springer New York 2013. Cham : Springer Nature
On-line přístup:	Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL
Poznámka:	Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale)
Autres localisations:	Voir dans le Sudoc
Edition sous un autre format:	• Design for high performance, low power, and reliable 3D integrated circuits, Sung Kyu Lim, New York, Springer, 2013, 1 vol. (XXVIII-560 p., 978-1-441-99541-4 • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits, Texte imprimé, 9781441995438 • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits, Texte imprimé, 9781489986962

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