Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous manufacturing-ready GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of ti...
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| 1. Verfasser: | |
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| Format: | Livre numérique |
| Sprache: | Anglais |
| Veröffentlicht: |
New York, NY :
Springer New York
2013.
Cham : Springer Nature |
| Online Zugang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Anmerkung: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Design for high performance, low power, and reliable 3D integrated circuits, Sung Kyu Lim, New York, Springer, 2013, 1 vol. (XXVIII-560 p., 978-1-441-99541-4 • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits, Texte imprimé, 9781441995438 • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits, Texte imprimé, 9781489986962 |