RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
保存先:
| その他の著者: | , , |
|---|---|
| フォーマット: | Livre numérique |
| 言語: | Anglais |
| 出版事項: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| 版: | 1st ed. 2010. |
| オンライン･アクセス: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| 注記: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • RF and microwave microelectronics packaging, [edited by] Ken Kuang, Franklin Kim, Sean S. Cahill, New York, Springer, 2010, 1 vol. (XVI-285 p.), 978-1-441-90983-1 |
目次:
- Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages Polymeric Microelectromechanical Millimeter Wave Systems Millimeter-Wave Chip-on-Board Integration and Packaging Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules RF/Microwave Substrate Packaging Roadmap for Portable Devices Ceramic Systems in Package for RF and Microwave Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications LTCC Substrates for RF/MW Application High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging High Performance Microelectronics Packaging Heat Sink Materials Technology Research on AlN 3D MCM