RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Gardado en:
| Outros autores: | , , |
|---|---|
| Formato: | Livre numérique |
| Idioma: | Anglais |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| Edición: | 1st ed. 2010. |
| Acceso en liña: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • RF and microwave microelectronics packaging, [edited by] Ken Kuang, Franklin Kim, Sean S. Cahill, New York, Springer, 2010, 1 vol. (XVI-285 p.), 978-1-441-90983-1 |
| LEADER | 03941nam a22003497a 4500 | ||
|---|---|---|---|
| 001 | 942788 | ||
| 008 | 110106q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN149049692 | ||
| 020 | |a 9781441909848 | ||
| 020 | |a 9781441909848 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.381 | ||
| 245 | 0 | 0 | |a RF and Microwave Microelectronics Packaging |c edited by Ken Kuang, Franklin Kim, Sean S. Cahill. |
| 250 | |a 1st ed. 2010. | ||
| 260 | |a New York, NY : |b Springer US : |b Imprint: Springer. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages Polymeric Microelectromechanical Millimeter Wave Systems Millimeter-Wave Chip-on-Board Integration and Packaging Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules RF/Microwave Substrate Packaging Roadmap for Portable Devices Ceramic Systems in Package for RF and Microwave Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications LTCC Substrates for RF/MW Application High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging High Performance Microelectronics Packaging Heat Sink Materials Technology Research on AlN 3D MCM | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices | ||
| 700 | 1 | |a Kuang, Ken. |4 pbd | |
| 700 | 1 | |a Cahill, Sean S. |4 pbd | |
| 700 | 1 | |a Kim, Franklin. |4 pbd | |
| 776 | 0 | |0 139619259 |t RF and microwave microelectronics packaging |f [edited by] Ken Kuang, Franklin Kim, Sean S. Cahill |c New York |n Springer |d 2010 |p 1 vol. (XVI-285 p.) |z 978-1-441-90983-1 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4419-0984-8 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-T236WQXW-R |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747832633 |u https://ezproxy.univ-orleans.fr/login?url=https://dx.doi.org/10.1007/978-1-4419-0984-8 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750850027 |u https://ezproxy.insa-cvl.fr/login?qurl=https://dx.doi.org/10.1007/978-1-4419-0984-8 |z Accès INSA CVL | |
| 997 | |0 942788 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||