Silver Metallization : Stability and Reliability
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...
محفوظ في:
| المؤلفون الرئيسيون: | , , |
|---|---|
| التنسيق: | Livre numérique |
| اللغة: | Anglais |
| منشور في: |
London :
Springer London
2008.
Cham : Springer Nature |
| سلاسل: | Engineering Materials and Processes
|
| الوصول للمادة أونلاين: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| ملاحظة: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Silver Metallization, Texte imprimé, 9781849967051 • Silver Metallization, Texte imprimé, 9781848006843 • Silver metallization, stability and reliability, Daniel Adams, Terry L. Alford, and James W. Mayer, London, Springer, 2008, 1 vol. (xi, 123 p.), Engineering materials and processes, 978-1-84800-026-1 |
جدول المحتويات:
- Silver Thin Film Characterization
- Diffusion Barriers and Self-encapsulation
- Thermal Stability
- Silver Electromigration Resistance
- Integration Issues
- Summary.