Silver Metallization : Stability and Reliability
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...
Gorde:
| Egile Nagusiak: | , , |
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| Formatua: | Livre numérique |
| Hizkuntza: | Anglais |
| Argitaratua: |
London :
Springer London
2008.
Cham : Springer Nature |
| Saila: | Engineering Materials and Processes
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| Sarrera elektronikoa: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Oharra: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Silver Metallization, Texte imprimé, 9781849967051 • Silver Metallization, Texte imprimé, 9781848006843 • Silver metallization, stability and reliability, Daniel Adams, Terry L. Alford, and James W. Mayer, London, Springer, 2008, 1 vol. (xi, 123 p.), Engineering materials and processes, 978-1-84800-026-1 |
| Gaia: | Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: preparation and characterization of elemental silver thin films and silver-metal alloys; formation of diffusion barriers and adhesion promoters; evaluation of the thermal stability of silver under different annealing conditions; evaluation of the electrical properties of silver thin films under various processing conditions; methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development. |
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| Alearen deskribapena: | Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| ISBN: | 9781848000278 |
| ISSN: | 2365-0761 |
| Sartu: | Accès en ligne pour les établissements français bénéficiaires des licences nationales Accès soumis à abonnement pour tout autre établissement Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. chttps://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 |