Silver Metallization : Stability and Reliability
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...
Enregistré dans:
| Auteurs principaux: | , , |
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| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
London :
Springer London
2008.
Cham : Springer Nature |
| Serier: | Engineering Materials and Processes
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| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Silver Metallization, Texte imprimé, 9781849967051 • Silver Metallization, Texte imprimé, 9781848006843 • Silver metallization, stability and reliability, Daniel Adams, Terry L. Alford, and James W. Mayer, London, Springer, 2008, 1 vol. (xi, 123 p.), Engineering materials and processes, 978-1-84800-026-1 |