Thermal and Power Management of Integrated Circuits
Thermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of...
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| Main Authors: | , |
|---|---|
| Format: | Livre numérique |
| Language: | Anglais |
| Published: |
New York, NY :
Springer US
2006.
Cham : Springer Nature |
| Series: | Integrated Circuits and Systems
|
| Online Access: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Thermal and Power Management of Integrated Circuits, Texte imprimé, 9781441938329 • Thermal and Power Management of Integrated Circuits, Texte imprimé, 9780387506920 • Thermal and Power Management of Integrated Circuits, Texte imprimé, 9780387257624 |
Table of Contents:
- Power, Junction Temperature, and Reliability
- Burn-in as a Reliability Screening Test
- Thermal and Electrothermal Modeling
- Thermal Runaway and Thermal Management
- Low Temperature CMOS Operation.