The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in l...
Enregistré dans:
| Andre forfattere: | , |
|---|---|
| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
London :
Springer London : Springer e-books
[20..].
Cham : Springer Nature |
| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, edited by Günter Grossmann, Christian Zardini., London, Springer-Verlag London Limited, 2011, 1 vol (VIII-313 p.), 978-0-85729-235-3 |
Indholdsfortegnelse:
- 1. Deformation and Fatigue of Solders 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints 3. Thermal Fatigue Analysis 4. Electrochemical Behavior of Solder Alloys 5. Void Formation by Kirkendall Effect in Solder Joints 6. Tin Whiskers 7. Electromigration in Solder Interconnects 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold 9. Reliability of Electronic Assemblies under Mechanical Shock Loading 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates 12. PCB Delamination 13. Excessive Warpage of Large Packages during Reflow Soldering 14. Popcorn Cracking 15. Thermal Capability of Components