The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in l...
Na minha lista:
| Outros Autores: | , |
|---|---|
| Formato: | Livre numérique |
| Idioma: | Anglais |
| Publicado em: |
London :
Springer London : Springer e-books
[20..].
Cham : Springer Nature |
| Acesso em linha: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, edited by Günter Grossmann, Christian Zardini., London, Springer-Verlag London Limited, 2011, 1 vol (VIII-313 p.), 978-0-85729-235-3 |
| LEADER | 04053nam a22003137a 4500 | ||
|---|---|---|---|
| 001 | 968827 | ||
| 008 | 110722q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN153867272 | ||
| 020 | |a 9780857292360 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.381 | ||
| 245 | 0 | 0 | |a The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects |c edited by Günter Grossmann, Christian Zardini. |
| 260 | |a London : |b Springer London : |b Springer e-books. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a 1. Deformation and Fatigue of Solders 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints 3. Thermal Fatigue Analysis 4. Electrochemical Behavior of Solder Alloys 5. Void Formation by Kirkendall Effect in Solder Joints 6. Tin Whiskers 7. Electromigration in Solder Interconnects 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold 9. Reliability of Electronic Assemblies under Mechanical Shock Loading 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates 12. PCB Delamination 13. Excessive Warpage of Large Packages during Reflow Soldering 14. Popcorn Cracking 15. Thermal Capability of Components | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics | ||
| 700 | 1 | |a Grossmann, Günter, |d 19..- |4 pbd | |
| 700 | 1 | |a Zardini, Christian, |d 1942-...., |c auteur en électronique. |4 pbd | |
| 776 | 0 | |0 155088602 |t The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects |f edited by Günter Grossmann, Christian Zardini. |c London |n Springer-Verlag London Limited |d 2011 |p 1 vol (VIII-313 p.) |z 978-0-85729-235-3 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-0-85729-236-0 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-95R69SJM-5 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:750616067 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/978-0-85729-236-0 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:753974576 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/978-0-85729-236-0 |z Accès INSA CVL | |
| 997 | |0 968827 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||