MEMS materials and processes handbook
MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The...
Enregistré dans:
| Auteur principal: | |
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| Autres auteurs: | |
| Format: | Livre numérique |
| Langue: | Anglais |
| Publié: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Édition: | 1st ed. 2011. |
| Collection: | MEMS Reference Shelf
1 |
| Accès en ligne: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Variante du titre: | The Handbook MEMs Materials and Processes offers a much more detailed treatment than the book by Leondes which is more general in its coverage and certainly less applied |
| Edition sous un autre format: | • MEMS materials and processes handbook, Reza Ghodssi, Pinyen Lin, editors, New York, Springer, 2011, 1 vol. (xxxv-1187 p.), MEMS reference shelf, 978-0-387-47316-1 • TEX, starting from 1, Michael Doob, Berlin, Springer-Verlag, 1993, 1 vol. (X-114 p.), 3-540-56441-1 |
Table des matières:
- Introduction - Reza Ghodssi and Pinyen Lin The MEMS Design Process - Tina Lamers and Beth Pruitt Additive Processes for Semiconductors and Dielectric Materials - Chris Zorman, Robert C. Roberts and Li Chen Additive Processes for Metals - David Arnold, Monika Saumer and Yong Kyu-Yoon Additive Processes for Polymeric Materials - Ellis Meng, Xin Zhang, and William Benard Additive Processes for Piezoelectric Materials - Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga Dry Etching for Micromachining Applications - Srinivas Tadigadapa and Franz Laermer MEMS Wet-Etch Processes and Procedures - David Burns MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi Doping - Alan D. Raisanen Wafer Bonding - Shawn Cunningham and Mario Kupnik MEMS Packaging Materials - Ann Garrison Darrin and Robert Osiander Surface Treatment and Planarization - Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan MEMS Process Integration - Michael Huff, Stephen Bart, and Pinyen Lin. .