Advances in Electronic Circuit Packaging : :: SCD d'Orléans

Advances in Electronic Circuit Packaging : Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964

Advances in Electronic Circuit Packaging : Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Awduron Eraill:	Rosine, Lawrence L. (Cydweithredwr)
Fformat:	Livre numérique
Iaith:	Anglais
Cyhoeddwyd:	Cham : Springer International Publishing [20..]. Cham : Springer Nature
Mynediad Ar-lein:	Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL
Nodyn:	Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale)
Autres localisations:	Voir dans le Sudoc
Edition sous un autre format:	• Advances in Electronic Circuit Packaging, Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964

Eitemau Tebyg

Advances in Electronic Circuit Packaging : Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Advances in Electronic Circuit Packaging : Volume 3

Electronics Packaging Forum : Volume Two

Packaging des circuits intégrés
Cyhoeddwyd: (2017)

Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
gan: Liu, Yong, 1966-

Manufacturing Challenges in Electronic Packaging
gan: Lee, Y. C., 19..-...., chercheur en mécanique, et al.

Electronic Equipment Packaging Technology
gan: Ginsberg, Gerald L.

Fuel cell electronics packaging

Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
gan: Hwang, Jennie S.

High-Frequency Characterization of Electronic Packaging
gan: Martens, Luc

Integrated Circuit Packaging, Assembly and Interconnections
gan: Greig, William J.
Cyhoeddwyd: (2007)

Nano-bio- electronic, photonic and MEMS packaging

Advanced Materials for Thermal Management of Electronic Packaging
gan: Tong, Xingcun Colin

Diffusion Soldering for the High-temperature Packaging of Power Electronics
gan: Syed-Khaja, Aarief
Cyhoeddwyd: (2025)

Basic Electronic Circuits
gan: Buckley, P. M., et al.

Advanced Electronic Circuits
gan: Tietze, Ulrich, 1946-, et al.

Intelligent Electronics and Circuits
Cyhoeddwyd: (2023)

Advanced Electronic Circuits
Cyhoeddwyd: (2023)

Electronic circuits : fundamentals and applications
gan: Tooley, Michael
Cyhoeddwyd: (2006)

Bio and nano packaging techniques for electron devices : advances in electronic device packaging
Cyhoeddwyd: (2012)

Advances in Cryogenic Engineering : Proceedings of the 1963 Cryogenic Engineering Conference University of Colorado College of Engineering and National Bureau of Standards Boulder Laboratories Boulder, Colorado August 19-21, 1963

Le packaging
gan: Heilbrunn, Benoît, 1969-, et al.
Cyhoeddwyd: (2012)

Le packaging
gan: Boulocher-Passet, Véronique, 19..-, et al.
Cyhoeddwyd: (2005)

Le packaging
gan: Heilbrunn, Benoît, 1969-, et al.
Cyhoeddwyd: (2012)

Advances in Cryogenic Engineering : Proceeding of the 1970 Cryogenic Engineering Conference The University of Colorado Boulder, Colorado June 17-17, 1970

Advances in Cryogenic Engineering : Proceedings of the 1960 Cryogenic Engineering Conference University of Colorado and National Bureau of Standards Boulder, Colorado August 23-25, 1960

Packaging in the Environment
gan: Levy, Geoffrey M.

Packaging in the Environment

Packaging for Sustainability
Cyhoeddwyd: (2012)

Food Packaging
gan: Grumezescu, Alexandru Mihai, 19..-
Cyhoeddwyd: (2016)

DNA Packaging.
Cyhoeddwyd: (2021)

Chromatin Packaging.
Cyhoeddwyd: (2023)

Packaging plastique
Cyhoeddwyd: (2009)

Chromatin Packaging.
Cyhoeddwyd: (2021)

Chromatin Packaging.
Cyhoeddwyd: (2022)

DNA Packaging.
Cyhoeddwyd: (2019)

Semiconductor Packaging
gan: Chen, Andrea, et al.
Cyhoeddwyd: (2021)

Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

Packaging des produits cosmétiques. Packaging secondaire et industrialisation
gan: Sabadie, Michel, et al.
Cyhoeddwyd: (2020)

Radiation Effects of Advanced Electronic Devices and Circuits
Cyhoeddwyd: (2026)

© 2021-2023 • Université d'Orléans, Service Commun de Documentation, 6 rue de Tours, 45072 Orléans cedex 2
+33(0) 2 38 41 71 84 • https://scd.univ-orleans.fr • Mentions légales