Lead Free Solder : Mechanics and Reliability
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...
Enregistré dans:
| Hovedforfatter: | |
|---|---|
| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
New York, NY :
Springer New York
2012.
Cham : Springer Nature |
| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Lead free solder, mechanics and reliability, John Hock Lye Pang, New York, NY, Springer, 2012, x, 175 p., 978-1-461-40462-0 • Lead Free Solder, Texte imprimé, 9781461404644 • Lead Free Solder, Texte imprimé, 9781489991164 |
Indholdsfortegnelse:
- Introduction
- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models
- Fatigue Life Prediction Models
- Finite Element Analysis and Design-For-Reliability
- Thermo-Mechanical Reliability Test and Analysis
- Dynamic Mechanical Reliability Test and Analysis
- Thermal Cycling Aging Effects on Board-Level Drop Test Result.