Madenci, E., Kilic, B., & Guven, I. Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®. Springer International Publishing.
Style de citation Chicago (17e éd.)Madenci, Erdogan, Bahattin Kilic, et Ibrahim Guven. Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®. Cham: Springer International Publishing.
Style de citation MLA (8e éd.)Madenci, Erdogan, et al. Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®. Springer International Publishing.
警告：這些引文格式不一定是100％准確.