Factors Governing Tin Whisker Growth
Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (...
Αποθηκεύτηκε σε:
| Κύριος συγγραφέας: | |
|---|---|
| Μορφή: | Livre numérique |
| Γλώσσα: | Anglais |
| Έκδοση: |
Cham :
Springer International Publishing
2013.
Cham : Springer Nature |
| Σειρά: | Springer Theses, Recognizing Outstanding Ph.D. Research
|
| Διαθέσιμο Online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Σημείωση: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Factors Governing Tin Whisker Growth, Texte imprimé, 9783319004693 • Factors Governing Tin Whisker Growth, Texte imprimé, 9783319004716 • Factors Governing Tin Whisker Growth, Texte imprimé, 9783319342818 |
Πίνακας περιεχομένων:
- Whiskers and Their Role in Component Reliability
- Film/Substrate Effects on Whisker Growth
- Environmental Effects of Whisker Growth
- Whisker Mitigation and Prevention
- Conclusions.