Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...
Guardado en:
| Otros Autores: | , , |
|---|---|
| Formato: | Livre numérique |
| Lenguaje: | Anglais |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| Acceso en línea: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Advanced Flip Chip Packaging, Texte imprimé, 9781441957672 |
Tabla de Contenidos:
- Flip Chip Technology Overview and Early Beginnings Technology Trends of Flip Chip Bumping Technologies Flip-Chip Interconnections: Past, Present and Future Underfill Conductive Adhesives for Flip Chip Applications Enabling Substrate Technologies: Past, Present and Future IC-Package-System Integrated Design Thermal Management of Flip Chip Packages Thermo-Mechanical Reliability in Flip Chip Packages Interfacial Reactions and Electromigration in Flip-Chip Solder Joints