Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...
Enregistré dans:
| Autres auteurs: | , , |
|---|---|
| Format: | Livre numérique |
| Langue: | Anglais |
| Publié: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| Accès en ligne: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Advanced Flip Chip Packaging, Texte imprimé, 9781441957672 |
| LEADER | 03260nam a22003377a 4500 | ||
|---|---|---|---|
| 001 | 946073 | ||
| 008 | 130507q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN169135004 | ||
| 020 | |a 9781441957689 | ||
| 020 | |a 9781441957689 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.381 | ||
| 245 | 0 | 0 | |a Advanced Flip Chip Packaging |c edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong. |
| 260 | |a New York, NY : |b Springer US : |b Imprint: Springer. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Flip Chip Technology Overview and Early Beginnings Technology Trends of Flip Chip Bumping Technologies Flip-Chip Interconnections: Past, Present and Future Underfill Conductive Adhesives for Flip Chip Applications Enabling Substrate Technologies: Past, Present and Future IC-Package-System Integrated Design Thermal Management of Flip Chip Packages Thermo-Mechanical Reliability in Flip Chip Packages Interfacial Reactions and Electromigration in Flip-Chip Solder Joints | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also:Offers broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear development history and touches on trends in the industry while also discussing up-to-date technology informationAdvanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging | ||
| 700 | 1 | |a Tong, Ho-Ming. |4 pbd | |
| 700 | 1 | |a Lai, Yi-Shao. |4 pbd | |
| 700 | 1 | |a Wong, C. P. |4 pbd | |
| 776 | 0 | |t Advanced Flip Chip Packaging |b Texte imprimé |z 9781441957672 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4419-5768-9 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-HB945Z20-5 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747888949 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/978-1-4419-5768-9 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750902027 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/978-1-4419-5768-9 |z Accès INSA CVL | |
| 997 | |0 946073 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||