Tong, H., Lai, Y., & Wong, C. P. Advanced Flip Chip Packaging. Springer US : Imprint: Springer.
Citazione stile Chigago Style (17a edizione)Tong, Ho-Ming, Yi-Shao Lai, e C. P. Wong. Advanced Flip Chip Packaging. New York, NY: Springer US : Imprint: Springer.
Citatione MLA (8a ed.)Tong, Ho-Ming, et al. Advanced Flip Chip Packaging. Springer US : Imprint: Springer.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.