Wafer level 3-D ICs process technology
Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...
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| Outros Autores: | , , |
|---|---|
| Formato: | Livre numérique |
| Idioma: | Anglais |
| Publicado em: |
New York, NY :
Springer US : Imprint: Springer
[20..].
Cham : Springer Nature |
| Edição: | 1st ed. 2008. |
| coleção: | Integrated Circuits and Systems
|
| Assuntos: | |
| Acesso em linha: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
L'impression du document génère 300 p. Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Wafer Level 3-D ICs Process Technology, Texte imprimé, 9780387765327 |
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| 041 | 0 | |a eng | |
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| 245 | 1 | 0 | |a Wafer level 3-D ICs process technology |c Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, editors. |
| 250 | |a 1st ed. 2008. | ||
| 260 | |a New York, NY : |b Springer US : |b Imprint: Springer. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Integrated Circuits and Systems |x 1558-9420 | |
| 500 | |a L'impression du document génère 300 p. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Overview of Wafer-Level 3D ICs Monolithic 3D Integrated Circuits Stacked CMOS Technologies Wafer-Bonding Technologies and Strategies for 3D ICs Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies Cu Wafer Bonding for 3D IC Applications Cu/Sn Solid#x2013;Liquid Interdiffusion Bonding An SOI-Based 3D Circuit Integration Technology 3D Fabrication Options for High-Performance CMOS Technology 3D Integration Based upon Dielectric Adhesive Bonding Direct Hybrid Bonding 3D Memory Circuit Architectures for 3D Integration Thermal Challenges of 3D ICs Status and Outlook | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration | ||
| 650 | |a Intégration sur tranche entière (circuits intégrés) | ||
| 700 | 1 | |a Gutmann, Ronald J. |4 edt | |
| 700 | 1 | |a Reif, L. Rafael. |4 edt | |
| 700 | 1 | |a Tan, Chuan Seng. |4 edt | |
| 776 | 0 | |t Wafer Level 3-D ICs Process Technology |b Texte imprimé |z 9780387765327 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-0-387-76534-1 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-JR2D0QZN-5 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747836973 |u https://ezproxy.univ-orleans.fr/login?url=https://dx.doi.org/10.1007/978-0-387-76534-1 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750854499 |u https://ezproxy.insa-cvl.fr/login?qurl=https://dx.doi.org/10.1007/978-0-387-76534-1 |z Accès INSA CVL | |
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