Solder joint reliability prediction for multiple environments
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...
Gorde:
| Egile Nagusiak: | , |
|---|---|
| Formatua: | Livre numérique |
| Hizkuntza: | Anglais |
| Argitaratua: |
New York, NY :
Springer US
2009.
Cham : Springer Nature |
| Gaiak: | |
| Sarrera elektronikoa: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Oharra: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Solder Joint Reliability Prediction for Multiple Environments, Texte imprimé, 9781441946348 • Solder Joint Reliability Prediction for Multiple Environments, Texte imprimé, 9780387570983 • Solder Joint Reliability Prediction for Multiple Environments, Texte imprimé, 9780387793931 |
Aurkibidea:
- Background
- Literature Review
- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue
- Validation of Unified FEM for Thermal Cycling and Power
- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling
- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration
- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters
- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages
- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments
- Solder Joint Reliability Assessment for Desktop and Space Applications.