Moisture sensitivity of plastic packages of IC devices
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...
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| Hlavní autor: | |
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| Další autoři: | |
| Médium: | Livre numérique |
| Jazyk: | Anglais |
| Vydáno: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Vydání: | 1st ed. 2010. |
| Edice: | Micro- and Opto-Electronic Materials, Structures, and Systems
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| On-line přístup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Poznámka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781441957184 • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781441957207 • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781461426257 |
Obsah:
- Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds Real-Time Characterization of Moisture Absorption and Desorption Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices Characterization of Hygroscopic Deformations by Moiré Interferometry Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages Industrial Applications of Moisture-Related Reliability Problems Underfill Selection Against Moisture in Flip Chip BGA Packages Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs) Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging Moisture-Driven Electromigrative Degradation in Microelectronic Packages Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation