Moisture sensitivity of plastic packages of IC devices
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...
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| Další autoři: | |
| Médium: | Livre numérique |
| Jazyk: | Anglais |
| Vydáno: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Vydání: | 1st ed. 2010. |
| Edice: | Micro- and Opto-Electronic Materials, Structures, and Systems
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| On-line přístup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Poznámka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781441957184 • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781441957207 • Moisture Sensitivity of Plastic Packages of IC Devices, Texte imprimé, 9781461426257 |
| Shrnutí: | Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: Thorough exploration of moisture s effects based on lectures and tutorials by the authors Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike |
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| Popis jednotky: | Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| ISBN: | 9781441957191 |
| ISSN: | 2626-238X |
| Přístup: | Accès en ligne pour les établissements français bénéficiaires des licences nationales Accès soumis à abonnement pour tout autre établissement Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 |