Materials for advanced packaging
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging tech...
Enregistré dans:
| Andre forfattere: | , |
|---|---|
| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
Boston, MA :
Springer US
[20..].
Cham : Springer Nature |
| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Materials for Advanced Packaging, Texte imprimé, 9780387782188 • Materials for Advanced Packaging, Texte imprimé, 9781441946119 • Materials for Advanced Packaging, Texte imprimé, 9780387569888 |
Indholdsfortegnelse:
- 3D Integration Technologies An Overview Advanced Bonding/Joining Techniques Advanced Chip-to-Substrate Connections Advanced Wire Bonding Technology: Materials, Methods, and Testing Lead-Free Soldering Thin Die Production Advanced Substrates: A Materials and Processing Perspective Advanced Print Circuit Board Materials Flip-Chip Underfill: Materials, Process and Reliability Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips Electrically Conductive Adhesives (ECAs) Die Attach Adhesives and Films Thermal Interface Materials Embedded Passives Nanomaterials and Nanopackaging Wafer Level Chip Scale Packaging Microelectromechanical Systems and Packaging LED and Optical Device Packaging and Materials Digital Health and Bio-Medical Packaging.