Materials for advanced packaging
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging tech...
Tallennettuna:
| Muut tekijät: | , |
|---|---|
| Aineistotyyppi: | Livre numérique |
| Kieli: | Anglais |
| Julkaistu: |
Boston, MA :
Springer US
[20..].
Cham : Springer Nature |
| Linkit: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Huomautus: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Materials for Advanced Packaging, Texte imprimé, 9780387782188 • Materials for Advanced Packaging, Texte imprimé, 9781441946119 • Materials for Advanced Packaging, Texte imprimé, 9780387569888 |
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| 245 | 0 | 0 | |a Materials for advanced packaging |c edited by Daniel Lu, C.P. Wong. |
| 260 | |a Boston, MA : |b Springer US. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a 3D Integration Technologies An Overview Advanced Bonding/Joining Techniques Advanced Chip-to-Substrate Connections Advanced Wire Bonding Technology: Materials, Methods, and Testing Lead-Free Soldering Thin Die Production Advanced Substrates: A Materials and Processing Perspective Advanced Print Circuit Board Materials Flip-Chip Underfill: Materials, Process and Reliability Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips Electrically Conductive Adhesives (ECAs) Die Attach Adhesives and Films Thermal Interface Materials Embedded Passives Nanomaterials and Nanopackaging Wafer Level Chip Scale Packaging Microelectromechanical Systems and Packaging LED and Optical Device Packaging and Materials Digital Health and Bio-Medical Packaging. | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering. | ||
| 700 | 1 | |a Lu, Daniel. |4 pbd | |
| 700 | 1 | |a Wong, C. P. |4 pbd | |
| 776 | 0 | |t Materials for Advanced Packaging |b Texte imprimé |z 9780387782188 | |
| 776 | 0 | |t Materials for Advanced Packaging |b Texte imprimé |z 9781441946119 | |
| 776 | 0 | |t Materials for Advanced Packaging |b Texte imprimé |z 9780387569888 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-0-387-78219-5 |z Accès sur la plateforme de l'éditeur | |
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| 997 | |0 941118 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||