A guide to lead-free solders : physical metallurgy and reliability

While tin/lead solders have dominated the electronics industry for many years, environmental considerations and new legislation are forcing change. Backed by more than ten years of research in Pb-free solders, many electronics manufacturers are poised for conversion. A Guide to Lead-free Solders is...

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Bibliografiske detaljer
Hovedforfatter: Evans, John W., 1957-
Andre forfattere: Engelmaier, Werner, 19..-2011 (Directeur de la publication)
Format: Livre numérique
Sprog:Anglais
Udgivet: London : Springer London [20..].
Cham : Springer Nature
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Kommentar: Archives Springer e-books (Licence nationale)
Archives Springer e-books (Licence nationale)
Autres localisations: Voir dans le Sudoc
Edition sous un autre format:• A Guide to Lead-free Solders, Texte imprimé, 9781849965774
• A Guide to Lead-free Solders, Texte imprimé, 9781848004733
• A Guide to Lead-free Solders, Texte imprimé, 9781846283093
Indholdsfortegnelse:
  • to Solder Alloys and Their Properties Packaging Architecture and Assembly Technology Wetting and Joint Formation Microstructural Instability in Solders Intermetallic Formation and Growth Mechanical Properties and Creep Behavior Thermomechanical Fatigue Product Assurance.