High power diode lasers : technology and applications

In a very comprehensive way this book covers all aspects of high power diode laser technology for materials processing. Basics as well as new application oriented results obtained in a government funded national German research project are described in detail. Along the technological chain after a s...

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Détails bibliographiques
Auteur principal: Bachmann, Friedrich, 1909-1982, mathématicien
Autres auteurs: Loosen, Peter, 1955- (Directeur de la publication), Poprawe, Reinhart, 1954- (Directeur de la publication)
Format: Livre numérique
Langue:Anglais
Publié: New York, NY : Springer New York [20..].
Cham : Springer Nature
Édition:1st ed. 2007.
Collection:Springer Series in Optical Sciences 128
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Note: Archives Springer e-books (Licence nationale)
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Edition sous un autre format:• High power diode lasers, technology and applications, Friedrich Bachmann, Peter Loosen, Reinhart Poprawe, editors, New York, Springer, 2007, 1 vol. (VI-548 p.), Springer series in optical sciences, 978-0-387-34453-9
Description
Résumé:In a very comprehensive way this book covers all aspects of high power diode laser technology for materials processing. Basics as well as new application oriented results obtained in a government funded national German research project are described in detail. Along the technological chain after a short introduction in the second chapter diode laser bar technology is discussed regarding structure, manufacturing technology and metrology. The third chapter illuminates all aspects of mounting and cooling, whereas chapter four gives wide spanning details on beam forming, beam guiding and beam combination, which are essential topics for incoherently coupled multi-emitter based high power diode lasers. Metrology, standards and safety aspects are the theme of chapter five. As an outcome of all the knowledge from chapter two to four various system configurations of high power diode lasers are described in chapter six; not only systems focussed on best available beam quality but especially also so called "modular" set-ups are considered, where assemblies adapted to special applications are chosen. Finally, a wide field of applications, performed with the systems described in chapter six is described in chapter seven
Description:Archives Springer e-books (Licence nationale)
Archives Springer e-books (Licence nationale)
ISBN:9780387347295
ISSN:1556-1534
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