Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
Bewaard in:
| Hoofdauteur: | |
|---|---|
| Formaat: | Livre numérique |
| Taal: | Anglais |
| Gepubliceerd in: |
New York, NY :
Springer US
2007.
Cham : Springer Nature |
| Online toegang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Opmerking: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Integrated Circuit Packaging, Assembly and Interconnections, Texte imprimé, 9780387281537 • Integrated Circuit Packaging, Assembly and Interconnections, Texte imprimé, 9780387508795 • Integrated Circuit Packaging, Assembly and Interconnections, Texte imprimé, 9781441939234 |
Inhoudsopgave:
- Electronic Manufacturing and the Integrated Circuit
- Integrated Circuit Manufacturing: A Technology Resource
- Packaging the IC Single Chip Packaging
- The Chip Scale Package
- Multichip Packaging
- Known Good Die (KGD)
- Packaging Options Chip on Board
- Chip & Wire Assembly
- Tape Automated Bonding TAB
- Flip Chip The Bumping Processes
- Flip Chip Assembly
- HDI Substrate Manufacturing Technologies: Thin Film Technology
- HDI Substrate Manufacturing Technologies: Thick Film Technology
- HDI Substrate Manufacturing Technologies: Cofired Ceramic
- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.