Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integ...
Enregistré dans:
| Auteurs principaux: | , , |
|---|---|
| Format: | Livre numérique |
| Sprog: | Anglais |
| Udgivet: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Udgivelse: | 1st ed. 2006. |
| Online adgang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Kommentar: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Micromachined thin-film sensors for SOI-CMOS co-integration, by Dr. J. Laconte,... Prof. D. Flandre,... and Prof. J.P. Raskin,..., Dordrecht, Springer, 2006, 1 vol. (xiii-292 p.), 0-387-28842-2 |
Indholdsfortegnelse:
- Introduction: Context and motivations Introduction: Context and motivations Techniques and materials Silicon bulk micromachining with TMAH Thin dielectric films stress extraction Microsensors Low power microhotplate as basic cell Microheater based flow sensor Gas Sensors on microhotplate SOI-CMOS compatibility validation Conclusions and outlook Conclusions and outlook.
- Introduction: Context and motivations
- Techniques and materials
- Microsensors
- Conclusions and outlook
- Silicon bulk micromachining with TMAH
- Thin dielectric films stress extraction
- Low power microhotplate as basic cell
- Microheater based flow sensor
- Gas Sensors on microhotplate
- SOI-CMOS compatibility validation