Interfacial Compatibility in Microelectronics : Moving Away from the Trial and Error Approach

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult tas...

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Main Authors: Laurila, Tomi, Vuorinen, Vesa (Author), Paulasto-Kröckel, Mervi (Author), Turunen, Markus (Author), Mattila, Toni T. (Author), Kivilahti, Jorma (Author)
Format: Livre numérique
Language:Anglais
Published: London : Springer London [20..].
Cham : Springer Nature
Edition:2012.
Series:Microsystems
Online Access:Accès sur la plateforme de l'éditeur
Accès sur la plateforme Istex
Accès Université d'Orléans
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Note: Archives Springer e-books (Licence nationale)
Archives Springer e-books (Licence nationale)
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Edition sous un autre format:• Interfacial Compatibility in Microelectronics, Texte imprimé, 9781447124696
• Interfacial Compatibility in Microelectronics, Texte imprimé, 9781447124719
• Interfacial Compatibility in Microelectronics, Texte imprimé, 9781447160687
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505 1 |a Introduction: Away from trial and error methods Materials and interfaces in Microsystems Introduction to mechanics of materials Introduction to thermodynamic-kinetic method Interfacial adhesion in polymer systems Evolution of different types of interfacial structures 
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520 |a Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the traditional method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.     
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