Metal-Dielectric Interfaces in Gigascale Electronics : Thermal and Electrical Stability
Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the a...
保存先:
| 主要な著者: | , |
|---|---|
| フォーマット: | Livre numérique |
| 言語: | Anglais |
| 出版事項: |
New York, NY :
Springer New York
2012.
Cham : Springer Nature |
| シリーズ: | Springer Series in Materials Science
157 |
| オンライン･アクセス: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| 注記: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Metal-Dielectric Interfaces in Gigascale Electronics, Texte imprimé, 9781461418139 • Metal-Dielectric Interfaces in Gigascale Electronics, Texte imprimé, 9781493943081 • Metal-Dielectric Interfaces in Gigascale Electronics, Texte imprimé, 9781461418115 |
目次:
- Preface
- 1. Introduction
- 2. Metal-Dielectric Diffusion Processes: Fundamentals
- 3. Experimental Techniques
- 4. Al-Dielectric Interfaces
- 5. Cu-Dielectric Interfaces
- 6. Barrier Metal-Dielectric Interfaces
- 7. Self-Forming Barriers. 8. Kinetics of Ion Drift
- 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions.