Advanced Materials for Thermal Management of Electronic Packaging
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smalle...
Enregistré dans:
| Auteur principal: | |
|---|---|
| Format: | Livre numérique |
| Langue: | Anglais |
| Publié: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Édition: | 1. |
| Collection: | Springer Series in Advanced Microelectronics
30 |
| Accès en ligne: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781441977588 • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781461427926 • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781441977601 |
Table des matières:
- CH. 1. Thermal managing fundamentals and design guide in electronic packaging 1.1 Introduction 1.2 Thermal management challenges and common concerns 1.3 Fundamentals of heat transfer 1.4 Thermal management solutions 1.5 Design for advanced thermal management of electronic packaging 1.6 Materials selection for advanced thermal management 1.7 Environmental compliance of thermal managing materials CH. 2. Characterization methodology of thermal managing materials 2.1 Thermal properties and measurement techniques 2.2 Electrical properties and measurement techniques 2.3 Thermomechanical characterization 2.4 Analytical techniques for materials characterization 2.5 Surface finish and contact interface compatibility 2.6 Reliability analysis and environmental performance evaluation CH. 3. Electronic packaging materials and their thermal managements 3.1 Materials selection for electronic packaging 3.2 Ceramics and semiconductors 3.3 Electronic glasses 3.4 Polymers 3.5 Monolithic metals 3.6 Metallic composites 3.7 Multimaterial laminates 3.8 Printed Circuit Board (PCB) Materials 3.9 Thermal interface materials 3.10 Advanced thermally conductive materials CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites 4.1 Introduction 4.2 Natural and industrial graphite 4.3 Pyrolytic graphite 4.4 Graphite/Carbon Foams 4.5 Thermally conductive carbon fibers 4.6 Diamond 4.7 Carbon Nanotubes 4.8 Carbon/carbon composites CH. 5. Thermally conductive polymer matrix composites 5.1 Introduction 5.2 Polymer matrix types 5.3 Reinforcements selection and its effect on thermal conductivity 5.4 General fabrication and manufacturing processes 5.5 Types and applications for thermal management CH. 6. High thermal conductivity metal matrix composites 6.1 Introduction 6.2 Processing of metal matrix composites 6.3 Aluminum matrix composites 6.4 Copper matrix composites 6.5 Other metal matrix composites CH. 7. Thermally conductive ceramic matrix composites 7.1 Introduction 7.2 Diamond-SiC composites