Advanced Materials for Thermal Management of Electronic Packaging
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smalle...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Livre numérique |
| Sprache: | Anglais |
| Veröffentlicht: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Ausgabe: | 1. |
| Schriftenreihe: | Springer Series in Advanced Microelectronics
30 |
| Online Zugang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Anmerkung: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781441977588 • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781461427926 • Advanced Materials for Thermal Management of Electronic Packaging, Texte imprimé, 9781441977601 |