Three Dimensional System Integration : IC Stacking Process and Design
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...
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| Other Authors: | , , |
|---|---|
| Format: | Livre numérique |
| Language: | Anglais |
| Published: |
Boston, MA :
Springer US
[20..].
Cham : Springer Nature |
| Online Access: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Three dimensional system integration, IC stacking process and design, edited by Antonis Papanikolaou, Dimitrios Soudris and Riko Radojcic, New York, Springer, 2011, 1 vol. (viii, 246 p.), 978-1-441-90961-9 |
Table of Contents:
- The next step in system integration: the benefits of going 3-D Process technology for manufacturing Through-Silicon Vias (TSVs) Alternative 3D integration schemes Manufacturing issues in 3D stacked ICs TSV characterization Physical design of 3D stacked ICs DRAM on logic stacking 3D general purpose micro-processors 3D system design: a holistic design approach