Three Dimensional System Integration : IC Stacking Process and Design
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...
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| Outros Autores: | , , |
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| Formato: | Livre numérique |
| Idioma: | Anglais |
| Publicado em: |
Boston, MA :
Springer US
[20..].
Cham : Springer Nature |
| Acesso em linha: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Three dimensional system integration, IC stacking process and design, edited by Antonis Papanikolaou, Dimitrios Soudris and Riko Radojcic, New York, Springer, 2011, 1 vol. (viii, 246 p.), 978-1-441-90961-9 |
| LEADER | 04430nam a22003377a 4500 | ||
|---|---|---|---|
| 001 | 968130 | ||
| 008 | 110208q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN149903057 | ||
| 020 | |a 9781441909626 | ||
| 020 | |a 9781441909626 | ||
| 041 | 0 | |a eng | |
| 082 | |a 720 | ||
| 245 | 0 | 0 | |a Three Dimensional System Integration : |b IC Stacking Process and Design |c edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic. |
| 260 | |a Boston, MA : |b Springer US. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a The next step in system integration: the benefits of going 3-D Process technology for manufacturing Through-Silicon Vias (TSVs) Alternative 3D integration schemes Manufacturing issues in 3D stacked ICs TSV characterization Physical design of 3D stacked ICs DRAM on logic stacking 3D general purpose micro-processors 3D system design: a holistic design approach | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing | ||
| 700 | 1 | |a Papanikolaou, Antonis. |4 pbd | |
| 700 | 1 | |a Soudris, Dimitrios, |d 1964- |4 pbd | |
| 700 | 1 | |a Radojcic, Riko. |4 pbd | |
| 776 | 0 | |0 153240180 |t Three dimensional system integration |o IC stacking process and design |f edited by Antonis Papanikolaou, Dimitrios Soudris and Riko Radojcic |c New York |n Springer |d 2011 |p 1 vol. (viii, 246 p.) |z 978-1-441-90961-9 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4419-0962-6 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-70DBHQ4G-G |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:750624124 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/978-1-4419-0962-6 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:753981580 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/978-1-4419-0962-6 |z Accès INSA CVL | |
| 997 | |0 968130 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||