3D Integration for NoC-based SoC Architectures
Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems conne...
Salvato in:
| Autore principale: | |
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| Altri autori: | , |
| Natura: | Livre numérique |
| Lingua: | Anglais |
| Pubblicazione: |
New York, NY :
Springer New York
2011.
Cham : Springer Nature |
| Serie: | Integrated Circuits and Systems
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| Accesso online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • 3D Integration for NoC-based SoC Architectures, Texte imprimé, 9781461427483 • 3D Integration for NoC-based SoC Architectures, Texte imprimé, 9781441976192 • 3D integration for NoC-based SoC architectures, Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch, editors, New York, Springer, 2011, 1 vol. (X-278 p.), Integrated circuits and systems, 978-1-441-97617-8 |
Sommario:
- Three-Dimensional Integration of Integrated Circuits - an Introduction
- The Promises and Limitation of 3-D Integration
- Testing 3D Stacked ICs Containing Through-Silicon Vias
- Design and Computer Aided Design of 3DIC
- Physical Analysis of NoC Topologies for 3-D Integrated Systems
- Three-Dimensional Networks-on-Chip: Performance Evaluation
- Asynchronous 3D-NoCs
- Design of Application-Specific 3D Networks-on-Chip Architectures
- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks
- 3-D NoC on Inductive Wireless Interconnect
- Influence of Stacked 3D Memory/Cache architectures on GPUs.