Reliability, Yield, and Stress Burn-In : :: SCD d'Orléans

Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing & Software Development

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Dades bibliogràfiques
Autors principals:	Kuo, Way, 1951-, Chien, Wei-Ting Kary (Autor), Kim, Taeho (Autor)
Format:	Livre numérique
Idioma:	Anglais
Publicat:	Cham : Springer International Publishing [20..]. Cham : Springer Nature
Accés en línia:	Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL
Nota:	Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale)
Autres localisations:	Voir dans le Sudoc
Edition sous un autre format:	• Reliability, Yield, and Stress Burn-In, A Unified Approach for Microelectronics Systems Manufacturing & Software Development

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