Advanced ceramic technologies & products.
Since the last century, ceramics have become essential to modern society and our daily lives. They have become an indispensable product to many industries, especially within the fields of electronics, automobiles, medicine, and leisure. Japanese ceramic technologies and products are highly sophistic...
Guardat en:
| Autor corporatiu: | |
|---|---|
| Format: | Livre numérique |
| Idioma: | Anglais |
| Publicat: |
Tokyo :
Springer Japan : Imprint: Springer
[20..].
Cham : Springer Nature |
| Accés en línia: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Advanced Ceramic Technologies & Products, Texte imprimé, 9784431539131 |
Taula de continguts:
- I. Introduction 1. Introduction to Ceramics 2. Classification of Ceramics 2.1 Monolithic Ceramics (single crystal, sintered body, glass, etc.) 2.2 Composite Materials 3. Raw Materials of Ceramics 4. Synthesis of Ceramics 4.1 Sintering 4.2 Single Crystal Synthesis Methods 4.3 Glass Synthesi 4.4 Plasma 4.5 Ultrahigh Pressure Synthesis 4.6 Soft Chemical Synthesis 4.7 Thin Film Deposition 4.8 Powders and Fine Particles 5. Characteristics of Ceramics 5.1 Mechanical Properties 5.2 Thermal Properties 5.3 Electrical Properties (1) Dielectric, Pyroelectric and Piezoelectric Properties 5.4 Electrical Properties (2) Electronic Conductivity, Ionic Conductivity,Mixed Conductivity 5.5 Magnetic Properties 5.6 Optical Properties II. Information Technology and Electroceramics 6. Portable Mobile Terminals and Information Appliances 6.1 SAW Filters 6.2 FeRAM 6.3 TCXO (Temperature Compensated X tal Oscillator) 6.4 Dielectric Filter for Microwaves 6.5 Multilayer Chip LC Filter 6.6 Isolator 6.7 Chip Capacitor 6.8 Grain Boundary Insulation Type Barrier Layer Capacitor 6.9 Wound Chip Inductor 6.10 Multilayer Chip Inductor 6.11 PTC Thermistors 6.12 Noise Suppression Sheet 6.13 Piezoelectric Gyro 6.14 Ultrasonic Motor 6.15 Multilayer Ceramic Speaker 6.16 Lithium-Ion Batteries 7. Computer 7.1 Multilayer Ceramic Circuit Substrate 7.2 Ceramic Package 7.3 Hybrid IC Incorporating Low Temperature Co-fired Ceramic Multilayer Substrate 7.4 Aluminum Nitride Substrate for Semiconductor Device 7.5 Silicon Carbide for High Thermal Conductivity Substrate 7.6 Single Crystal Sapphire Substrate 8. Office Automation Devices 8.1 Inkjet Printer Head 8.2 Thermal Print Head 9. Displays