Materials for information technology : devices, interconnects and packaging
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of mate...
Uloženo v:
| Další autoři: | Zschech, Ehrenfried (Šéfredaktor, odpovědný redaktor), Mikolajick, Thomas (Šéfredaktor, odpovědný redaktor), Whelan, Caroline (Šéfredaktor, odpovědný redaktor) |
|---|---|
| Médium: | Livre numérique |
| Jazyk: | Anglais |
| Vydáno: |
London :
Springer London
[20..].
Cham : Springer Nature |
| Vydání: | 1st ed. 2005. |
| Edice: | Engineering Materials and Processes
|
| On-line přístup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Poznámka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Materials for information technology, devices, interconnects and packaging, Ehrenfried Zschech, Caroline Whelan and Thomas Mikolajick (eds.), London, Springer, 2005, 1 vol. (xix-508 p.), Engineering materials and processes, 1-85233-941-1 |
Podobné jednotky
- Nonlinear Optical Materials and Devices for Applications in Information Technology (Livre numérique)
-
Copper Interconnect Technology
(Livre numérique)
Gupta, Tapan -
Packaging technology and science.
(Revue numérique)
John Wiley & Sons, 1988 -
Advanced Interconnect and Packaging
(Livre numérique)
MDPI - Multidisciplinary Digital Publishing Institute, 2023 -
Advanced Wirebond Interconnection Technology
(Livre numérique)
Prasad, Shankara K.

